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| MRS1504T3 Surface Mount Standard Recovery Power Rectifier SMB Power Surface Mount Package Features mesa epitaxial construction with glass passivation. Ideally suited for high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Features http://onsemi.com * Compact Package with J-Bend Leads Ideal for Automated Handling * Stable, High Temperature, Glass Passivated Junction * Pb-Free Package is Available Mechanical Characteristics: STANDARD RECOVERY RECTIFIER 1.5 AMPERES, 400 VOLTS * * * * * * Case: Molded Epoxy Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Maximum Temperature of 260C / 10 Seconds for Soldering Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead SMB CASE 403A PLASTIC MARKING DIAGRAM MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TI = 118C) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TI = 118C) Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Storage/Operating Case Temperature Range Operating Temperature Range Symbol VRRM VRWM VR IO IFRM IFSM Value 400 Unit V AYWW RGG G G 1.5 3.0 50 A A A A = Assembly Location Y = Year WW = Work Week RGG = Device Code G = Pb-Free Package (Note: Microdot may be in either location) Tstg, TC TJ -55 to 150 -55 to 150 C C ORDERING INFORMATION Device MRS1504T3 Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (on 1 sq. Cu. PCB pattern) Symbol Rtjl Rtja Value 18 79 Unit C/W C/W MRS1504T3G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Minimum pad size. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 1 June, 2006 - Rev. 4 Publication Order Number: MRS1504T3/D MRS1504T3 ELECTRICAL CHARACTERISTICS Rating Maximum Instantaneous Forward Voltage (Note 2), see Figure 2 (IF = 1.5 A) (IF = 2.25 A) Maximum Instantaneous Reverse Current, see Figure 4 (VR = 400 V) (VR = 200 V) 2. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0% IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 Symbol VF 1.04 1.10 IR 1.0 0.5 340 180 0.96 1.02 mA TJ = 25_C TJ = 100_C Unit V 100 100 10 TJ = 100C 1.0 TJ = 150C TJ = 25C TJ = -40C 0.1 0.6 0.8 1.0 1.2 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 1.6 10 TJ = 100C 1.0 TJ = 150C TJ = 25C 0.1 0.6 0.8 1.0 1.2 1.4 1.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage I R, MAXIMUM REVERSE CURRENT (AMPS) 100E-6 I R, REVERSE CURRENT (AMPS) 10E-6 TJ = 150C TJ = 100C 10E-3 Figure 2. Maximum Forward Voltage 1.0E-3 TJ = 150C TJ = 100C 100E-6 10E-6 1.0E-6 100E-9 TJ = 25C 1.0E-6 TJ = 25C 10E-9 100E-9 10E-9 0 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 400 1.0E-9 0 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 400 Figure 3. Typical Reverse Current I O , AVERAGE FORWARD CURRENT (AMPS) FREQ = 20 kHz PFO , AVERAGE POWER DISSIPATION (WATTS) 2.5 dc 2.0 SQUARE WAVE 1.5 1.0 Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 0.5 0 0 20 40 Ipk/Io = 20 2.5 2.0 Figure 4. Maximum Reverse Current dc SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 1.5 1.0 0.5 0 0 Figure 5. Current Derating 60 80 100 120 TL, LEAD TEMPERATURE (C) 140 160 Figure 6. Forward Power Dissipation http://onsemi.com 2 0.5 1.0 1.5 2.0 IO, AVERAGE FORWARD CURRENT (AMPS) 2.5 MRS1504T3 100 TJ = 25C C, CAPACITANCE (pF) 10 1.0 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (VOLTS) 70 80 Figure 7. Capacitance R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZE 1.0 50% 20% 0.1 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 0.01 T, TIME (s) 0.1 1.0 10 100 Figure 8. Thermal Response, Junction-to-Lead R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 50% 0.1 20% 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 0.01 0.1 T, TIME (s) 1.0 10 100 1,000 Figure 9. Thermal Response, Junction-to-Ambient http://onsemi.com 3 MRS1504T3 PACKAGE DIMENSIONS SMB CASE 403A-03 ISSUE F HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 b D A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 MRS1504T3/D |
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